TQFP32 to DIP28 Adapter Socket — fast, reliable chip testing and prototyping Key benefits Converts TQFP32 surface-mount packages to a DIP28 footprint for use on breadboards, DIP sockets, and development boards. Solderless, stable connection that lets you test and swap chips quickly without permanent assembly. Precise hole alignment ensures consistent contact across all pins for accurate measurements and reliable circuit evaluation. Made from durable ABS for a lightweight, resilient adapter that stands up to repeated use in labs, workshops, and classrooms. What it does Function: accepts TQFP32 chips and adapts their pinout to a DIP28 pin arrangement. Compatibility: designed specifically for TQFP32 packages and standard DIP28 prototyping sockets and PCBs. Performance: provides a stable, repeatable connection suitable for testing, debugging, firmware development, and short-term evaluations. Why you need it Speeds up development and troubleshooting by eliminating the need to design or solder adapter PCBs for initial testing. Makes it easy to evaluate replacement chips or prototype SMT parts using through-hole tools and breadboards. Keeps experiments non‑destructive: test multiple devices without committing to soldered connections. Practical use scenarios Firmware development: mount a TQFP32 microcontroller in the adapter to program, debug, and iterate code on a breadboard or DIP-based development board. Educational labs: demonstrate surface-mount component function and circuit concepts without soldering; ideal for classroom experiments and student projects. Repair and diagnostics: temporarily install a suspect TQFP32 chip to verify behavior, compare readings, or confirm replacements before permanent rework. Key attributes at a glance Adapter type: TQFP32 to DIP28 socket Material: ABS (durable, lightweight) Connection: solderless, stable contact Use cases: chip testing, prototyping, education, debugging Simple to use, reliable in testing, and compatible with standard DIP28 tooling — this adapter bridges the gap between surface-mount components and through-hole development environments.