The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance efficiency cost considerations dealing with the newer IC packaging technologies and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook a new volume in the Electrical Engineering Handbook Series provides essential factual information on the design manufacturing and testing of electronic devices and systems. Co-published with the IEEE this is an ideal resource for engineers and technicians involved in any aspect of design production testing or packaging of electronic products regardless of whether they are commercial or industrial in nature. Topics addressed include design automation new IC packaging technologies materials testing and safety. Electronics packaging continues to include expanding and evolving topics and technologies as the demand for smaller faster and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic mechanical and thermal designers and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field. . Language: English