Direct Heating Capability This rework stencil can be directly heated with hot air, enabling quick thermal transfer and efficient solder reflow. Eliminates the need for intermediate heating stages, making memory chip reballing faster and more effective. Reballing Station Set Includes a sturdy template holder jig with an Ltype wrench that securely positions stencils during operation and movement, ensuring precise alignment for various packages including desktop graphics and notebook integrated memory modules. Stainless Steel Construction Crafted from stainless steel, these welding tools withstand repeated thermal cycles without warping or degradation, maintaining their integrity and performance through numerous rework applications. Compatibility For Packages Specifically designed for use with 0.45mm solder balls, these stencils deliver accurate solder ball placement for second and thirdgeneration memory chips, ensuring reliable connections and professionalgrade results every time. Applications and scenarios Reball memory chips on notebook integrated memory modules and desktop graphics memory during or rework. Reball 0.45mm memory packages in second and thirdgeneration memory chips for reliable connections. Use in professional shops performing memory module reballing with hot air rework for efficient, repeatable results.