PTM7950 Phase Change Thermal Interface Material PTM7950 is a thermal conductivity phase change material available in both pad and paste formats. It is engineered to reduce thermal resistance at interfaces, provide consistent long term performance through reliability testing, and support scalable application at competitive cost. Key benefits Low interface thermal resistance: The polymer PCM system wets contact surfaces as it reaches normal operating temperatures, producing extremely low surface contact resistance and improving heat transfer across interfaces. Proven reliability: Maintains performance after extended stress testing, including 150 C baking for 1000 hours and T/CB 1000 cycles. Flexible form factors: Offered as a readytouse pad for simple placement or as a paste for precise dispensing and gap filling. Manufacturability: Suitable for automated or manual application, enabling scalable production without complex process changes. Cost effective solution: Combines performance with materials and formats chosen for efficient assembly and repeatable results. What it does PTM7950 fills microscopic voids and surface irregularities between mating components, converting to a thin, conformal conductive layer at operating temperature to minimize thermal impedance. The material is optimized for operating temperature ranges typical of power electronics and computing hardware, where interface wetting and consistent contact are critical. Key attributes Material: Novel polymer based phase change material Formats: Thermal pad and thermal paste Performance highlights: thermal conductivity and very low surface contact resistance; stable after 150 C bake for 1000 hours and T/CB 1000 cycles Function: Thermal interface material for heat spreading and conduction between components Compatibility: Designed for use with common heat sinks, cold plates, power packages, semiconductor modules, and circuit assemblies where low interface thermal resistance is required Typical applications Power electronics: Thermal management of MOSFETs, IGBTs, and power converter modules to improve heat transfer and support reliable operation under power cycling. Computing and data center equipment: Interface material between CPUs, GPUs, or memory modules and heatsinks to reduce junction temperatures and support sustained performance. Lighting and automotive electronics: Thermal coupling for LED arrays, control modules, and automotive power electronics where stable thermal contact over life is required. Why choose PTM7950 PTM7950 delivers a balance of low thermal impedance, durable performance under accelerated aging and cycling tests, and flexible application formats. It is suitable for engineers seeking a reliable, scalable thermal interface solution for demanding electronic and power management applications.