Photosensitive film for PCB production that is compatible with standard plating baths and a range of substrate materials. Designed to deliver uniform coverage without wrinkles or color errors and to support electroplating, hole covering, and etching processes. Key benefits Reliable plating compatibility: Works with usual plating baths to maintain coating integrity during electroplating. Stable, uniform coating: Engineered to resist wrinkles and color variation for consistent pattern definition. Broad material adaptability: Adapts to different PCB substrate materials commonly used in board manufacturing. Multiprocess functionality: Suitable for electroplating, hole covering, and etching, reducing the need for multiple masking products. Improves process outcomes: Applied to PCB surfaces to make them photosensitive and to help increase conversion rates during production. Main features and performance Function: Acts as a photosensitive layer that can be patterned for selective plating and etching. Compatibility: Designed for standard PCB manufacturing workflows and common plating chemistries. Material form: Photosensitive film applied to the PCB surface to enable photolithography steps. Performance: Provides consistent adhesion and dimensional stability through exposure, development, and plating steps. Practical applications and use scenarios Selective electroplating: Apply the film to create precise masks for copper buildup on traces and pads during selective plating operations. Hole covering and via protection: Use the film to seal or cover through holes and vias during surface plating to prevent unwanted deposition. Etching and pattern transfer: Employ the film as a photoresist layer for etching processes to define circuit patterns with clear edges and minimal defects. How it fits into your process Apply the photosensitive film to a clean, prepared PCB surface to make the surface photosensitive. Pattern the film through exposure and development to create the desired mask. Proceed with electroplating, hole covering, or etching steps as required by your workflow, then remove the film according to your process requirements. Why choose this product Reduces common process issues such as wrinkling and color inconsistency. Simplifies handling across multiple PCB materials and standard plating baths. Combines masking, hole covering, and photoresist functions into one adaptable product for streamlined production. Compatibility note Intended for use with standard PCB substrates and typical plating bath chemistries found in PCB fabrication and assembly environments. Contents and handling Supplied as a photosensitive film for application to PCB surfaces. Follow standard handling and exposure procedures used in PCB photolithography and plating operations.