Product overview This is a photosensitive dry film for PCB fabrication and . The film adheres to the PCB surface and, after exposure and development, becomes a photoresist layer suitable for plating, hole covering, and etching processes. Key benefits resolution: Produces clear, detailed traces and patterns after exposure, suitable for fine PCB work. Strong adhesion: Bonds well to most substrate surfaces to reduce lifting and peeling during processing. hole coverage: Covers drilled holes effectively to support reliable plating and etching results. Easy to use: Can be applied and fixed with simple tools and common workflow steps for prototyping and small batch production. Specifications Color: black Material: PLA Dimensions: 30 cm x 500 cm (11.8 in x 197 in) Weight: approx. 150 g Package contents: 1 x Photosensitive film Typical applications PCB prototyping: Create detailed single or double sided prototype boards with clear traces and pads. Plating and via processing: Use to cover through holes and support consistent plating and via formation. Etching and pattern transfer: Apply for accurate etching masks when producing small runs or repairs. Basic use steps 1. Uncover film from protective sheets; the photosensitive layer is sandwiched between two liners. 2. Paste the film onto the PCB surface and smooth it flat to remove air pockets. 3. Heat lightly with an electric iron to secure adhesion. 4. Place the printed film pattern onto the board. 5. Expose to UV light. 6. Develop to remove unexposed areas and reveal the pattern. 7. Etch the board as required. 8. Demould or strip the resist after processing. Notes on handling and performance Ensure the board surface is clean and dry before applying the film for adhesion. Apply even pressure when pasting to avoid bubbles and ensure uniform contact. Follow standard exposure and development times for your exposure unit and developer chemistry to achieve resolution. This photosensitive dry film is designed to simplify small scale PCB production and repairs while delivering reliable adhesion, hole coverage, and resolution for common plating and etching workflows.