1. Introduction. - 1. 1. Early CPU Performance Estimators. - 1. 2. Current Ongoing Work. - 1. 3. RIPE: Rensselaer Interconnect Performance Estimator. - 1. 4. National Technology Roadmap For Semiconductors. - 1. 5. Summary. - References. - 2. System Level Representation. - 2. 1. System Performance Metrics. - 2. 2. Microprocessor System Organization. - 2. 3. Summary. - References. - 3. Interconnect Parameters. - 3. 1. Interconnect Resistance. - 3. 2. Interconnect Capacitance. - 3. 3. Inductance. - 3. 4. Electromigration. - 3. 5. Yield. - 3. 6. Summary. - References. - 4. Transistor Count and Area Models. - 4. 1. Memory Structures. - 4. 2. I/O Structures. - 4. 3. CPU Logic. - 4. 4. Summary. - References. - 5. System Wireability. - 5. 1. Wireability Issue. - 5. 2. Wiring Methodology. - 5. 3. Wiring Distribution Model. - 5. 4. Wiring Capacity. - 5. 5. Wiring Demand. - 5. 6. Total Wiring Demand. - 5. 7. Summary. - References. - 6. Device Parameters. - 6. 1. Transistor Output Resistance. - 6. 2. Effective Logic Gate Output Resistance. - 6. 3. Device Capacitance. - 6. 4. Logic Gate Capacitance. - 6. 5. Summary. - References. - 7. Cycle Time Estimation Model. - 7. 1. Critical Path. - 7. 2. Propagation Delay Model. - 7. 3. Crosstalk. - 7. 4. Summary. - References. - 8. System Power Dissipation. - 8. 1. Power Dissipation Sources. - 8. 2. Power Estimation Methods. - 8. 3. Power Estimation. - 8. 4. Off-Chip Driver Power Dissipation. - 8. 5. Random Logic Power Dissipation. - 8. 6. Clock Distribution Power Dissipation. - 8. 7. Interconnect Power Dissipation. - 8. 8. Memory Power Dissipation. - 8. 9. Switching Activity and Activity Factors. - 8. 10. Summary. - References. - 9. Microprocessor Performance Evaluation. - 9. 1. RIPE Model Benchmarking. - 9. 2. 1994 NTRS Performance Predictions. - 9. 3. 1994 NTRS Power Dissipation Predictions. - 9. 4. 1994 Roadmap and Technology Status. - 9. 5. Wiring Capacity and Die Size. - 9. 6. Future Work Directions. - 9. 7. Book Summary. - References. Language: English