The IS2814 is a 16pin device packaged in a SOIC16175mil package. This compact, surfacemount format is designed for density PCBs and is compatible with standard reflow soldering processes. Each contains one IS2814 device in the specified SOIC16 package. Key benefits Spaceefficient: 16pin SOIC package enables compact, density circuit layouts. Easy to integrate: Standard surfacemount package supports automated assembly and precise placement. Broad footprint compatibility: SOIC16 form factor aligns with common PCB footprints and handling procedures. Replacement and : Suitable for replacing IS2814 devices on boards that use this package and pin count. Clear pin access: Gullwing leads in a conventional SOIC layout facilitate straightforward soldering and inspection. Key attributes Model: IS2814 Package: SOIC16 Body size: 175 mil package width (SOIC16175mil) Pin count: 16 Mounting type: Surfacemount Lead style: Standard gullwing leads Packaging material: Standard surfacemount encapsulation (as per industry norms) Compatibility and performance notes Designed for use in applications that require an IS2814 device in a SOIC16 package. Suits standard PCB footprints and conventional reflow soldering processes. For electrical characteristics, pin configuration, and application suitability, refer to the IS2814 datasheet. Use cases Replacement: Swap in a damaged IS2814 device on a board that uses a SOIC16 footprint, facilitating with minimal board modification. design: Include the IS2814 in a development or production PCB that requires a 16pin SOIC package, benefiting from the compact form factor. Prototyping and evaluation: Use in prototype boards or evaluation kits that utilize standard SOIC16 components to validate system behavior before finalizing a design. Note Please consult the official IS2814 datasheet for electrical specifications, pinout, and recommended operating conditions to ensure proper integration and performance in your application.