1: Electronic Packaging and High Frequencies. - 1. 1 Packaging and high-frequency effects. - 1. 2 Overview of the book chapters. - References. - 2: Electrical Description of Electronic Packaging. - 2. 1 Introduction. - 2. 2 Circuit descriptions. - 2. 3 Qualitative characteristics. - 2. 4 Conclusions. - References. - 3: High-Frequency Measurement Techniques. - 3. 1 Introduction. - 3. 2 Frequency-domain instruments. - 3. 3 Time-domain network analyzer. - 3. 4 Comparison of frequency- and time-domain network analyzers. - 3. 5 Error correction. - 3. 6 Conclusion. - References Appendix 3. A: Spatial resolution of the TDR/T-technique. - 4: High-Frequency Measurement Techniques for Electronic Packaging. - 4. 1 Introduction. - 4. 2 General test fixtures. - 4. 3 Dedicated test fixtures with coaxial-planar transitions. - 4. 4 On-board probing. - 4. 5 Comparison of the coaxial-planar and coplanar probe transitions. - 4. 6 De-embedding. - 4. 7 Measuring 2N-port structures with two-port instruments. - 4. 8 Conclusion. - References. - 5: Measurement-Based Modeling Algorithms. - 5. 1 Introduction. - 5. 2 One-port components. - 5. 3 Transmission lines. - 5. 4 General interconnections and packaging. - 5. 5 Conclusions. - References. Language: English