Six pieces of FSA553UCX in WLCSP9 packaging are included in this listing. The FSA553UCX is a waferlevel chipscale packaged device offered in a WLCSP9 form factor, designed to support compact, density board layouts. This set is suitable for designers and technicians who need multiple units for production runs, prototyping, or spare parts. Key benefits Compact, spacesaving form factor: WLCSP9 packaging enables a small footprint ideal for tight PCB layouts and portable devices. density interconnect in a waferlevel package: nine pads/pins in a streamlined package help maximize board real estate while maintaining reliable connections. Ready for standard SMT processes: designed for conventional surfacemount assembly and reflow soldering, supporting efficient manufacturing. Multipack convenience: six pieces per provide ample supply for development, testing, and production needs. Brandaligned specification integrity: presented as the FSA553UCX WLCSP9 device with consistent packaging and model identification for straightforward sourcing and replacement. Key attributes Functionality: a waferlevel chipscale packaged device supplied in the FSA553UCX family within a WLCSP9 package. Compatibility: suitable for standard surfacemount technology and PCB manufacturing workflows that accommodate WLCSP9 devices. Size and packaging: WLCSP9 form factor, providing a compact package option for spaceconstrained applications. Material and construction: packaged at the wafer level in a chipscale configuration, consistent with WLCSP design principles. Performance characteristics: designed to deliver reliable operation within the intended SMT assembly and application environment, consistent with the FSA553UCX packaging specification. Applications and use cases Board prototyping and evaluation: ideal for engineers validating layout, routing, and mechanical fit on compact development boards. Replacement parts for spaceconstrained devices: convenient for inventory and fieldrework of smallformfactor products that use WLCSP9 components. Embedded and wearable electronics: suitable for inclusion in IoT devices, wearables, and other compact systems requiring a dense, reliable package. In summary, this listing provides six pieces of the FSA553UCX WLCSP9 package. It offers a compact, SMTfriendly solution with density inter Six pieces of FSA553UCX in WLCSP9 packaging are included in this listing. The FSA553UCX is a waferlevel chipscale packaged device offered in a WLCSP9 form factor, designed to support compact board layouts and spaceconstrained designs. This multipack is suitable for designers and technicians who need multiple units for production runs, prototyping, or spare parts. Key benefits Compact, spacesaving form factor for tight PCB layouts and portable devices. SMTready packaging that supports conventional surfacemount assembly and reflow soldering processes. Multipack convenience with six pieces per for development, testing, and production needs. Brandaligned identification and packaging consistency for straightforward sourcing and replacement. Key attributes Functionality: a waferlevel chipscale packaged device in the FSA553UCX family within the WLCSP9 form factor. Compatibility: designed for standard surfacemount technology and PCB manufacturing workflows that accommodate WLCSP9 devices. Size and packaging: WLCSP9 packaging provides a compact option for spaceconstrained applications. Material and construction: waferlevel chipscale packaging consistent with WLCSP design principles. Performance characteristics: engineered to deliver reliable operation within typical SMT assembly and application environments, aligned with the FSA553UCX packaging specification. Applications and use cases Board prototyping and evaluation: suitable for engineers validating layout, routing, and mechanical fit on compact development boards. Replacement parts for spaceconstrained devices: convenient for inventory management and field rework of smallformfactor products that use WLCSP9 components. Embedded and wearable electronics: applicable to IoT devices, wearables, and other compact systems requiring a dense, reliable package. In summary, this listing provides six pieces of the FSA553UCX WLCSP9 package. It offers a compact, SMTfriendly solution with density packaging suitable for spacelimited designs.