ESD Antistatic IC Chip Sponge Box Grid size 15x15x3mm; 20 units Product highlights Protects sensitive components from electrostatic discharge and mechanical shock during storage and transport. Compact and lightweight for easy handling and . Durable plastic outer case with removable antistatic sponge inserts to cushion and secure parts. Grid cells sized 15 x 15 x 3 mm, supplied in a 20 unit configuration to organize multiple small components. Available in several box sizes and inner sponge shapes to match different component types and storage needs. Key benefits Prevents ESD damage: Antistatic sponge reduces the risk of staticrelated failures for ICs and small electronic parts. Organized storage: Individual grid cells keep components separated and easy to identify, reducing handling time and assembly errors. Safe transit: Sponge padding absorbs impact and vibration to protect delicate leads and packages during shipment. Reusable and practical: Lightweight case is easy to open, close, and reuse for sample kits, prototyping, or inventory control. Compatibility and materials Designed for IC chips and a wide range of small electronic components such as SMD parts, transistors, diodes, and similar items. Constructed with a sturdy plastic exterior and quality antistatic sponge interior to balance protection and durability. Grid size 15x15x3mm suitable for most small chip packages; sold with 20 units per set. Typical use scenarios Sample delivery: Pack and a set of IC samples to customers or colleagues with reduced risk of ESD damage. Workshop and : Store frequently used small components in a workshop or bench to keep parts organized and protected. Prototyping and assembly: Prepare component kits for PCB assembly or prototyping runs, keeping parts separated and accessible. What you receive One antistatic component storage box with grid size 15x15x3mm, 20 units Removable sponge inserts and a secure plastic case This ESD antistatic IC chip sponge box provides a practical, reliable way to store, organize, and transport small electronic components while minimizing static and mechanical risk.