Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces
+ $10.49 Shipping
Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces
- Brand: Unbranded
Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces
- Brand: Unbranded
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Description
- Brand: Unbranded
- Category: Education
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Artist: B Keser
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Format: Hardback
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Language: English
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Publication Date: 2021/12/29
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Publisher / Label: Wiley
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Number of Pages: 320
- Fruugo ID: 336021188-739627701
- ISBN: 9781119793779
Delivery & Returns
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STANDARD: $10.49 - Delivery between Mon 27 October 2025–Thu 30 October 2025
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