Manual suction tin (desoldering pump) Key benefits - Protects delicate PCB areas and components, especially LSIs, by lifting molten solder without forceful scraping or damage. - Simple, reliable operation with a spring-loaded mechanism that gives consistent suction when activated. - Durable construction using plastic and aluminum with a heat-resistant plastic nozzle head to withstand high soldering temperatures. - Easy maintenance: the suction head can be removed for cleaning to prevent solder residue buildup and ensure a tight seal during use. - Compact, hand-held design suitable for one-handed operation and tight workspaces. What it is and how it works - The suction tin is a manual desoldering pump used to remove molten solder from joints. It is built to minimize the risk of board damage and make repetitive desoldering tasks more efficient. - Construction materials: body primarily plastic and aluminum; the solder nozzle head is made of heat-resistant plastic. - The device includes a spring-loaded plunger. When used, press the end slider until you hear a click to engage the suction mechanism. While the solder joint is melted with a soldering iron, operate the nozzle to draw molten solder into the pump. Proper use - Step 1: Prepare and engage. With the tool in hand, push the end slider until you hear a click. The suction mechanism is fixed in the ready position. - Step 2: Desolder. Heat the solder joint with a soldering iron until the solder melts. Position the nozzle over the molten solder and activate the suction to draw solder into the pump. - Step 3: Repeat as needed. If more solder remains, reheat the joint and repeat the suction process until the joint is clear. - Step 4: After use, clean and inspect. If the suction head has solder residue, remove the head and clean the slag to restore proper sealing and suction. Maintenance and care - After use, detach the suction head if needed and remove any solder slag. Clean the parts to prevent clogging and maintain suction performance. - Ensure the nozzle and seal are free of debris before storing. - Store in a dry area away from excessive heat or force on the plunger. Use scenarios - Reworking LSIs and other delicate ICs on motherboards where precise solder removal minimizes the risk of board damage. - Desoldering DIP ICs or surface-mount components on compact PCBs during repair or component salvage. - General electronic repair projects requiring safe removal of molten solder from joints without aggressive scraping. Specifications and attributes - Function: manual desoldering pump for removing solder from joints with controlled suction. - Compatibility: suitable for typical PCB work, including delicate components where minimized heat transfer and mechanical stress are important. - Materials: plastic and aluminum body; heat-resistant plastic nozzle head. - Size and handling: compact hand-held design for easy one-handed operation and use in tight workspaces. - Performance: spring-loaded plunger provides ready-to-use suction once engaged, aiding efficient solder removal. Notes - Regular cleaning after use helps maintain seal integrity and suction strength. - If the nozzle head is clogged, remove and clean to restore optimal performance. - Use with appropriate soldering temperatures and safety practices to protect components and yourself.