Aluminum alloy cover: integrally formed heat sink style cover provides better heat dissipation. Material is aluminum alloy for durability and effective thermal transfer. Resin potting: offers thermal conductivity and complete sealing to protect internal components from moisture, dust, and environmental exposure. Special customized capacitor: features an electrolytic capacitor designed for this module to support reliable electrical performance and power handling. Magnetic ring: utilizes magnetic flux density for effective filtration, contributing to EMI reduction and improved signal integrity. Use scenarios Power supply modules and chargers: suitable where efficient heat dissipation and robust environmental sealing are required. Motor drives and industrial controllers: helps meet EMI suppression requirements while protecting components in harsh environments. power audio amplifiers or LED drivers: provides dependable capacitor performance with strong cooling and filtration for stable operation. Key attributes Function: heat management, protection, filtration Compatibility: designed as a cohesive module with integrated components Size: compact enclosure with integrated cooling and sealing Material: aluminum alloy cover, resin potting Performance: improved heat dissipation, sealing, capacitor reliability, and EMI filtration