APX81123UG7 SOT143 is a semiconductor device packaged in a compact SOT143 surfacemount package. This listing includes 10 pieces. Key benefits Space saving package: SOT143 footprint enables compact PCB layouts for spaceconstrained designs. SMT ready: Designed for standard surfacemount assembly and reflow processes, supporting automated production. Reliable sourcing: Sold in a practical 10piece quantity for prototyping, testing, and small production runs. Clear part identification: Consistent labeling and traceability on each device for easy inventory management. Versatile integration: Suitable for a range of electronic circuits where a small, discrete semiconductor component is required. Key attributes Functionality: A semiconductor device intended for installation within electronic circuits. The exact electrical function is defined by the APX81123UG7 datasheet. Compatibility: SOT143 package compatible with common SMT assembly methods and PCB designs. Size: Small formfactor SOT143 package suitable for compact electronics. Material: Plastic encapsulated surfacemount device. Performance: Built to meet standard quality and reliability expectations for SMT components; refer to the manufacturer specifications for detailed electrical characteristics. Applications Prototyping and development on compact boards where space is at a . Replacement part in production lines or activities that use the APX81123UG7 in SOT143 packaging. Embedded and consumer electronics assemblies requiring a small, surfacemount component with reliable performance. Packaging content 10 pieces per , addressing design, testing, and smallscale production needs.