Advances in Embedded and Fan-Out Wafer Level Packaging Technologies

$149.00
+ $14.49 Shipping

Advances in Embedded and Fan-Out Wafer Level Packaging Technologies

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Advances in Embedded and Fan-Out Wafer Level Packaging Technologies

$149.00

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  • Brand: Unbranded

Description

Advances in Embedded and Fan-Out Wafer Level Packaging Technologies

Language: English
  • Brand: Unbranded
  • Category: Education
  • Format: Hardback
  • Language: English
  • Publication Date: 2019/03/29
  • Publisher / Label: Wiley
  • Fruugo ID: 505679691-1034824123
  • ISBN: 9781119314134

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Dispatched within 6 days

  • STANDARD: $14.49 - Delivery between Fri 07 August 2026–Wed 12 August 2026

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