thermal conductivity for effective heat dissipation: up to 4.98 W/mK (gold) and 4.39 W/mK (silver), enabling rapid cooling for CPUs and other electronic components Professionalgrade thermal interface with easy application: clean surfaces, spread evenly using included tools, and form a paperthin conductive layer across CPUs, GPUs, and power conversion units Broad applicability for heat management: essential for laptops, power LEDs, networking devices, and storage drives where heat transfer occurs between processors, chassis, and cooling modules Designed for enthusiasts and professionals: suitable for PC builders, enthusiasts, and hardware engineers requiring efficient thermal management in performance computing systems Practical use scenarios Desktop PC or workstation builds: apply to CPU and GPU surfaces to improve heat transfer and maintain performance under load Laptop or compact devices: enhance cooling performance in portable systems to reduce throttling Networking gear and storage arrays: ensure reliable heat transfer between processors, chassis, and cooling modules to sustain operation Key considerations Includes tools for spreading the paste; surfaces should be cleaned prior to application Creates a conductive layer that is designed to be paperthin for effective contact and heat transfer across multiple components