5PCS SPF5189Z SOT89 SMD RF Amplifier ICs Overview This pack contains five SPF5189Z RF amplifier integrated circuits in SOT89 surface mount packages. Each unit is a compact, boardmountable amplifier IC designed for integration into RF frontend designs and small form factor wireless equipment. Key benefits Ready for assembly: SOT89 surface mount package supports automated pick and place and straightforward soldering for prototype and production boards. Space efficient: Small footprint lets you add amplification where board area is limited without compromising mechanical stability. Consistent replacement parts: Pack of five identical SPF5189Z devices helps maintain inventory for repairs, development, or small production runs. Application focused: Designed for RF amplification tasks, helping improve signal levels within receiver and transmitter stages when integrated according to design guidelines. Important attributes Model: SPF5189Z, specified in SOT89 package, sold as a set of 5 pieces. Function: RF amplifier IC intended for use in radio frequency signal chains. Package and size: SOT89 molded package, surface mount device suitable for PCB assembly and rework processes. Construction: Semiconductor IC in standard SMD epoxy package for reliable mounting and thermal performance typical of SOT89 parts. Performance orientation: Optimized for RF use and stable operation in compact designs when biased and matched per circuit requirements. Practical use scenarios and replacement: Keep on hand for replacing damaged amplifier ICs on wireless routers, gateway modules, or other RF equipment. Prototyping and development: Use in evaluation boards and prototype PCBs to test RF frontend designs and component placement choices. Embedded wireless devices: Integrate into small wireless modules, IoT nodes, or handheld RF instruments where a compact amplifier solution is required. What you receive Five SPF5189Z RF amplifier ICs in SOT89 surface mount package, identical parts for consistent performance across repairs and prototypes. Note Install and bias these devices according to your circuit design and component datasheet recommendations to achieve expected RF performance.