The BV05CH in SOD323 package is a compact surfacemount component supplied as five pieces per package. Designed for tight PCB layouts, this BV05CH device fits standard SOD323 footprints and is suitable for automated SMT assembly. Key benefits Small form factor enables density layouts and slim device profiles. SMTfriendly design supports standard reflow soldering and automated assembly. Five pieces per pack provide convenient stocking, testing, and prototyping. Consistent model identification with BV05CH ensures reliable replication across designs. Easy replacement on boards that use the SOD323 footprint. Key attributes Model: BV05CH Package: SOD323, surfacemount Quantity per pack: 5 pieces Footprint compatibility: suitable for boards designed for SOD323 components Functionality: BV05CH device intended for use in electronic circuits Performance: designed for reliable operation as specified for the BV05CH model within typical operating conditions Applications and use cases Prototyping and development on compact PCBs that leverage SOD323 components, enabling rapid iteration with a small, lowprofile package. Replacement or on consumer electronics and wearables that use BV05CH parts in a SOD323 footprint, supporting compact and servicefriendly designs. Integration into spaceconstrained signal paths or protective circuits on small formfactor assemblies, where a SOD323 device is appropriate and compatible with existing layouts.