- Release Surface for Elevated Temperature Curing: This product is specifically designed to facilitate the fabrication of parts that are cured at high temperatures, ensuring a smooth release and minimizing the risk of damage during the process. - Gold Finger Protection: Ideal for masking the gold fingers of printed circuit boards (PCBs) during wave soldering or solder dip processes. This protection helps maintain the integrity and functionality of sensitive components, preventing costly repairs or replacements. - High-Temperature Compatibility: Engineered for high-temperature applications, this product excels in environments such as wave soldering and protects bar code labels that may be exposed to elevated temperatures. Its durability ensures reliable performance even under extreme conditions. Key Features: - Material: Crafted from high-quality materials that withstand elevated temperatures without compromising performance. - Size: Available in various sizes to cater to different parts and PCB configurations, ensuring a perfect fit for your specific needs. - Performance: Provides excellent adhesion and protection, ensuring that critical components remain intact throughout the manufacturing process. Use Scenarios: 1. Wave Soldering: Use this product to mask and protect gold fingers on PCBs during wave soldering, ensuring that connections remain reliable and free from solder bridging. 2. High-Temperature Label Protection: Protect bar code labels from damage during high-temperature processes, ensuring that your labels remain legible and functional throughout the production cycle. 3. Part Fabrication: Utilize this release surface in curing processes for parts requiring high-temperature settings, improving efficiency and reducing scrap rates. Choose this product for dependable high-temperature performance and robust protection, designed to meet the demands of modern manufacturing environments.