3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility

$159.00
+ $10.49 Shipping

3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility

  • Brand: Unbranded
  • product image
3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility

3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility

  • Brand: Unbranded
Price: $159.00
Sold by:
$159.00
+ $10.49 Shipping

Taxes calculated at checkout

Only 5 left in stock

14-Day Returns Policy

Payment methods:

Description

3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility

Language: English
  • Brand: Unbranded
  • Category: Computing & Internet
  • Artist: Lih-Tyng Hwang
  • Format: Hardback
  • Language: English
  • Publication Date: 2018/07/18
  • Publisher / Label: Wiley
  • Number of Pages: 464
  • Fruugo ID: 336019382-739625870
  • ISBN: 9781119289647

Delivery & Returns

Dispatched within 7 days

  • STANDARD: $10.49 - Delivery between Tue 20 January 2026–Fri 23 January 2026

Shipping from United Kingdom.

We do our best to ensure that the products that you order are delivered to you in full and according to your specifications. However, should you receive an incomplete order, or items different from the ones you ordered, or there is some other reason why you are not satisfied with the order, you may return the order, or any products included in the order, and receive a full refund for the items. View full return policy