Enhanced four layer board design with a revised antenna RF performance optimization, delivering 30 to 50 percent longer communication distance compared to ESP12E. Semi hole chip technology with full IO leads and a metal shielding shell to improve electromagnetic shielding and overall reliability. Pins and footprint are fully compatible with ESP12E and our relevant breakout boards for easy dropin replacement and seamless integration. Wireless standards supported: 802.11 b / g / n. Practical compatibility and upgrade benefits: keeps the same form factor and connector layout, enabling straightforward migration of ESP12E based designs to a version with improved RF performance without redesigning existing circuits. Use case scenarios 1) Smart home networks: deploy in wireless sensors, door/window sensors, or smart switches where extended range reduces the need for repeaters and improves reliability in larger homes. 2) Industrial or commercial monitoring: suitable for remote equipment monitoring or environmental sensing in spaces with electrical noise, where the metal shielding shell helps minimize interference and maintain stable connections. 3) Prototyping and upgrading ESP12E projects: use as a dropin upgrade on existing ESP12E based breakout boards for projects requiring better range without changing the overall board layout.