Package contains two pieces of HFD23/0051ZS in a DIP package sized 7.5 x 12.5 mm, intended for throughhole PCB mounting. Key benefits Exact fit: Built to the HFD23/0051ZS DIP footprint for straightforward replacement or designs that require this specific component. Space efficient: Compact 7.5 x 12.5 mm package helps save board area in spaceconstrained projects. Easy assembly: Throughhole leads allow reliable solder joints and simple hand or wave soldering during assembly. Consistent form factor: Standardized dimensions and pin layout make it compatible with common DIP sockets, perfboards, and PCB footprints. Important attributes Model: HFD23/0051ZS Quantity: 2 pieces Package type: DIP throughhole Size: 7.5 x 12.5 mm Construction: Molded DIP package with metal leads suitable for soldering How it solves problems Reduces replacement time by matching the exact footprint of existing HFD23/0051ZS placements. Minimizes redesign work by fitting standard DIP layouts on PCBs and prototyping boards. Simplifies assembly and with throughhole mounting that is tolerant to manual soldering. Practical applications Component replacement for circuit boards that use HFD23/0051ZS DIP parts. Prototyping and development on perfboard or custom PCBs that require a 7.5 x 12.5 mm DIP footprint. Smallscale assembly and of electronic equipment where a reliable throughhole DIP component is needed. Installation and handling tips Confirm PCB footprint matches 7.5 x 12.5 mm DIP dimensions before soldering. Insert leads fully and solder each pin for secure mechanical and electrical connection. Handle with basic ESD precautions if working in sensitive electronic assemblies. Supplied as two HFD23/0051ZS DIP components, ready for immediate use in compatible throughhole applications.